From October 27 to 29, 2026, WELLMAN participated in NEPCON ASIA 2026 at the Shenzhen World Exhibition & Convention Center, China.
During the three-day exhibition, our team welcomed visitors from the electronics manufacturing industry, demonstrated our equipment, and exchanged ideas about inspection technology, production efficiency, and material management.
At NEPCON ASIA 2026, WELLMAN introduced three key product categories designed to support different stages of electronics manufacturing.
Industrial X-Ray Inspection Systems
Our industrial X-ray inspection equipment helps manufacturers examine internal structures and detect hidden defects in electronic assemblies, including BGA solder joints, solder voids, and other soldering abnormalities.
Industrial 3D CT Inspection Systems
Our 3D CT technology provides three-dimensional imaging and internal structure analysis, supporting detailed inspection of PCB, PCBA, semiconductor packages, and complex electronic components.
X-Ray SMD Component Counter (XC01)
In addition to inspection equipment, WELLMAN also presented its XC01 X-ray SMD component counting machine.
Designed for counting electronic components on reels, the XC01 helps manufacturers and electronics warehouses improve component counting efficiency, verify material quantities, and simplify inventory management.
Together, these solutions demonstrate WELLMAN's focus on both electronic quality inspection and material management.
Throughout the exhibition, our team had opportunities to meet customers, distributors, and other industry professionals.
Visitors learned about our products, discussed their production requirements, and explored how X-ray inspection and automated component counting could support their operations.
These conversations also gave our team valuable insights into the practical challenges faced by electronics manufacturers.
NEPCON ASIA 2026 has come to an end, and we would like to thank everyone who visited our booth and spent time speaking with our team.
We appreciated your interest in our industrial X-ray inspection systems, 3D CT technology, and X-ray SMD component counting solutions.
Although the exhibition has ended, our communication with customers and partners continues.
WELLMAN remains committed to developing practical solutions for electronics inspection, component counting, and production management.
Thank you for being part of NEPCON ASIA 2026. We look forward to seeing you again!
From October 27 to 29, 2026, WELLMAN participated in NEPCON ASIA 2026 at the Shenzhen World Exhibition & Convention Center, China.
During the three-day exhibition, our team welcomed visitors from the electronics manufacturing industry, demonstrated our equipment, and exchanged ideas about inspection technology, production efficiency, and material management.
At NEPCON ASIA 2026, WELLMAN introduced three key product categories designed to support different stages of electronics manufacturing.
Industrial X-Ray Inspection Systems
Our industrial X-ray inspection equipment helps manufacturers examine internal structures and detect hidden defects in electronic assemblies, including BGA solder joints, solder voids, and other soldering abnormalities.
Industrial 3D CT Inspection Systems
Our 3D CT technology provides three-dimensional imaging and internal structure analysis, supporting detailed inspection of PCB, PCBA, semiconductor packages, and complex electronic components.
X-Ray SMD Component Counter (XC01)
In addition to inspection equipment, WELLMAN also presented its XC01 X-ray SMD component counting machine.
Designed for counting electronic components on reels, the XC01 helps manufacturers and electronics warehouses improve component counting efficiency, verify material quantities, and simplify inventory management.
Together, these solutions demonstrate WELLMAN's focus on both electronic quality inspection and material management.
Throughout the exhibition, our team had opportunities to meet customers, distributors, and other industry professionals.
Visitors learned about our products, discussed their production requirements, and explored how X-ray inspection and automated component counting could support their operations.
These conversations also gave our team valuable insights into the practical challenges faced by electronics manufacturers.
NEPCON ASIA 2026 has come to an end, and we would like to thank everyone who visited our booth and spent time speaking with our team.
We appreciated your interest in our industrial X-ray inspection systems, 3D CT technology, and X-ray SMD component counting solutions.
Although the exhibition has ended, our communication with customers and partners continues.
WELLMAN remains committed to developing practical solutions for electronics inspection, component counting, and production management.
Thank you for being part of NEPCON ASIA 2026. We look forward to seeing you again!
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