ข้อมูลรายละเอียด

สถานที่กำเนิด:

จีน

ได้รับการรับรอง:

CE,FDA，ISO 9001

เน้น:

400*400mm Large Stage Semiconductor Inspection Equipment

10kg Load Capacity 3D X Ray Inspection System

คำอธิบายผลิตภัณฑ์

X8800 Semiconductor Inspection Equipment

Advanced 3D/CT inspection system featuring a 400×400mm large stage with 10kg load capacity for comprehensive semiconductor analysis.

Key Advantages

Open type X-ray tube with unlimited service life (only filament replacement required)
New generation 5" HD digital flat panel detector (FPD)
FPD tilts 60° and rotates 360° for optimal positioning
Automatic navigation window - table moves to clicked positions
400×400mm table with 10kg load capacity
Speed adjustable 5-axis linkage system
Optional ACT and PCT 3D CT functionality
Intuitive operation with minimal training required (approximately 2 hours)

Hardware Specifications

X-ray Source

Flat Panel Detector

Table Specifications

Equipment Details

Safety Features

Radiation Leakage	No leakage, international standard: ≤1μSv/h
Lead Glass Observation Window	Transparent lead glass shields radiation for internal status observation
Window and Back Door Safety Interlock	X-ray tube powers off immediately when opened; prevents X-ray activation when open
Electromagnetic Safety Switch	Locks when X-ray is active, preventing window opening
Emergency Stop	Located near operation position for immediate power cutoff
Tube Protection	Prevents software exit without closing X-ray tube

Working Principle

Software Capabilities

Core Functions

Function Module	Operation
X-ray Tube Control	Mouse-click activation with real-time voltage/current display and adjustment
Status Bar	Visual indication of interlock, pre-heat, and X-ray status
Image Effect Adjustment	Brightness, contrast and gain controls for optimal imaging
Product List	Save and recall inspection parameters for efficiency
Navigation Window	Click-to-move table positioning with camera guidance
Motion Axis Status	Real-time coordinate display
Inspection Result	Organized display of measurement data (voids rate, distance, area)
Speed Control	Adjustable movement speed for each axis (slow, normal, fast)

Voids Rate Measurement

Feature	Description
Automatic Calculation	Rectangle-based solder ball analysis with automatic void detection and NG/OK indication
Parameters Adjustment	Customizable grayscale threshold, pixel, contrast, and size filtering
Manual Void Addition	Polygon or free-form drawing for custom void calculation
Parameter Saving	Store and recall detection parameters for consistent results

Additional Measurement Functions

Function	Application
Distance	Vertical distance measurement from point to baseline
Distance Rate	Through-hole soldering rate calculation via percentage ratio
Angle	Angle measurement between defined rays
Radius	Circular component measurement (solder balls) for circumference, area, radius
Perimeter	Square component measurement for length, width, and area

Automated Inspection Modes

Mode	Description
Manual Setting	Custom inspection point placement with automatic imaging
Array	Grid-based automatic inspection from minimal setup parameters
Automatic Identification	Feature-based position recognition with automated measurement and imaging

Application Examples