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60° Tiltable FPD X Ray System High Resolution Imaging BGA Solder Void Analysis
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PENGHITUNG SINAR X

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＋86 18406666351
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＋86 18406666351
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60° Tiltable FPD X Ray System High Resolution Imaging BGA Solder Void Analysis

Nama Merek: WELLMAN
Nomor Model: X6000
Moq: 1
Harga: 24000-34000 USD
Ketentuan Pembayaran: T/T
Informasi Detail
Deskripsi produk
Informasi Detail
Tempat asal:
Cina
Sertifikasi:
CE, FDA
Jenis sinar-X:
Tertutup, fokus mikro
Tegangan tabung maks:
90kV
Arus tabung maks:
200μA
Ukuran Titik Fokus:
5μm
Daerah yang efektif:
130mm*130mm
Kemasan rincian:
kotak kayu
Menyoroti:

60° tiltable X-ray machine

,

high-resolution FPD X-ray system

,

BGA solder void analysis machine

Deskripsi produk
60° Tiltable FPD X-Ray System for High Resolution Imaging and BGA Solder Void Analysis
The Wellman Microfocus X-Ray Inspection System X6000 features a maintenance-free X-ray tube system that enables efficient inspection of BGA solder voids and PCB through-holes, paired with high-precision imaging capabilities.
Key Advantages
  • New-generation 5-inch high-definition digital flat panel detector (FPD)
  • 420×420mm work table supporting maximum load capacity of 15KG
  • Intuitive operation with only 2 hours of training required
  • 3-axis linkage system with adjustable movement speed
  • Programmable inspection processes enable automated batch inspection
  • Closed X-ray tube with 10,000+ hours service life and maintenance-free performance
  • Auto-navigation window: worktable moves directly to clicked position
  • Optional 360° rotary jig supports multi-angle inspection
Technical Specifications
X-ray Source
TypeClosed, microfocus
Max tube voltage90kV
Max tube current200μA
Focal spot size5μm
FunctionAuto preheat
Flat Panel Detector
Effective area130mm×130mm
Pixel size85μm
Resolution1536×1536
Frame rate20fps
Work Table
Size420mm×420mm
Detectable area400mm×400mm
Max load15kg
Equipment Parameters
MagnificationGeometry 150X | System 1500X
Inspection speedMax 3.0s/point
Dimensions1100mm (L) × 1000mm (W) × 1600mm (H)
Weight1000kg
Power supplyAC110-220V 50/60HZ
Max power1300W
Industrial PCIntel I5 CPU, 8G RAM, 240GB SSD
Displayer24" HDMI LCD
Safety Features
Radiation leakageNo leakage (≤1μSv/h, international standard)
Lead glass observation windowTransparent lead glass shields radiation while allowing internal observation
Window/door safety interlockX-ray automatically powers off when window/door is opened
Electromagnetic safety switchLocks observation window when X-ray is active
Emergency stopInstant power-off button near operation position
Tube protectionSoftware prevents X-ray tube from being left on
Working Principle
60° Tiltable FPD X Ray System High Resolution Imaging BGA Solder Void Analysis 0
X6000 X-ray inspection system working principle
Software Capabilities
Basic Operation
Full keyboard and mouse control for all functions, including X-ray tube activation and parameter adjustment.
Measurement Tools
Comprehensive measurement functions include distance, angle, radius, perimeter, and distance rate calculations, ideal for through-hole soldering analysis.
Automated Inspection
Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.
Image Processing
Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.
Voids Rate Measurement
Automatically calculates solder ball void rate, area, and circumference while identifying defects, and supports manual void marking and parameter saving for consistent results.
Application Examples
60° Tiltable FPD X Ray System High Resolution Imaging BGA Solder Void Analysis 1
X6000 inspection application example 1
60° Tiltable FPD X Ray System High Resolution Imaging BGA Solder Void Analysis 2
X6000 inspection application example 2
Tag: 

Mesin Sinar-X 3D untuk Elektronik  

Mesin sinar-X papan sirkuit  

mesin sinar-x untuk pcb

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