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XRay Inspection System Electronic Component Testing for Semiconductor

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ĐẾM TIA X

Máy X quang PCB

Tháp SMD

Kiểm tra X-quang tự động

Máy X-quang điện tử

Tủ lưu trữ keo hàn

Nguồn X-quang Hamamatsu

Máy X-quang BGA

Máy ghép tự động

Máy X-quang SMT

Hamamatsu Image Intensifier

Kiểm tra X-quang 3D

Máy tăng cường hình ảnh tia X

Liên hệ

Mr. Jeff Chan

sales8@well-man.com

＋86 18406666351

＋86 18406666351

nói chuyện ngay.

XRay Inspection System Electronic Component Testing for Semiconductor

Tên thương hiệu:	WELLMAN
Số mô hình:	X6000
MOQ:	1
Điều khoản thanh toán:	T/T

Thông tin chi tiết

Mô tả sản phẩm

Thông tin chi tiết

Nguồn gốc:

Trung Quốc

Chứng nhận:

CE, FDA

Bảo hành:

12 tháng

Hệ thống kiểm tra bằng Tia X Wellman X6000

kiểu:

Đóng, microfocus

Điện áp ống tối đa:

Dòng ống tối đa:

200μA

Kích thước tiêu điểm:

Khu vực hiệu quả:

130mm * 130mm

chi tiết đóng gói:

hộp gỗ

Làm nổi bật:

semiconductor X-ray inspection system

electronic component testing machine

X-ray machine for electronics

Mô tả sản phẩm

WELLMAN X6000 Microfocus X-Ray Inspection Machine

Industrial SMT PCB defect detection system with automated batch inspection and high precision imaging for BGA solder voids and PCB through holes.

Key Advantages

New-generation 5-inch high-definition digital flat panel detector (FPD)
Enclosed X-ray tube with >10,000 hours operational life (maintenance-free)
Operation is intuitive with only 2 hours of training needed
3-axis linkage system allows adjustment of speed
Programmable inspection programs support automated batch processing
Auto navigation window moves the worktable directly to the clicked position
420×420mm worktable with a maximum load capacity of 15KG
Optional 360° rotary jig enables multi-angle product inspection

Technical Specifications

X-ray Source

Type	Closed, microfocus
Max tube voltage	90kV
Max tube current	200μA
Focal spot size	5μm
Function	Auto preheat

Flat Panel Detector

Effective area	130mm*130mm
Pixel size	85μm
Resolution	1536*1536
Frame rate	20fps

Work Table

Size	420mm*420mm
Detectable area	400mm*400mm
Max load	15kg

Equipment Parameters

Magnification	Geometry 150X \| System 1500X
Inspection speed	Max 3.0s/point
Dimensions	1100mm (L) * 1000mm (W) * 1600mm (H)
Weight	1000kg
Power supply	AC110-220V 50/60HZ
Max power	1300W
Industrial PC	Intel I5 CPU, 8G RAM, 240GB SSD
Displayer	24" HDMI LCD

Safety Features

Radiation leakage	No leakage (≤1μSv/h, international standard)
Lead glass observation window	Transparent lead glass shields radiation while allowing internal observation
Window/door safety interlock	X-ray automatically powers off when window/door is opened
Electromagnetic safety switch	Locks observation window when X-ray is active
Emergency stop	Instant power-off button near operation position
Tube protection	Software prevents X-ray tube from being left on

Software Capabilities

Basic Operation

Full keyboard and mouse control for all functions, including X-ray tube activation and parameter adjustment.

Measurement Tools

Comprehensive measurement functions support distance, angle, radius, perimeter and distance rate calculations for through-hole soldering analysis.

Automated Inspection

Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.

Image Processing

Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.

Voids Rate Measurement

Automatically calculates solder ball voids rate area and circumference and identifies defects supports manual void marking and parameter saving for consistent results.

Working Principle

X6000 X-ray inspection system working principle

Application Examples

X6000 inspection application example 1

X6000 inspection application example 2

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