The WELLMAN X6800 microfocus X-ray inspection system delivers reliable internal defect detection for SOP packages, ensuring consistent quality in electronic manufacturing.
Equipped with a 5μm microfocus X-ray source and 1500X system magnification, the X6800 clearly reveals hidden issues in SOP components such as die attach voids, wire bond defects, and solder joint abnormalities.
The 60° tiltable flat panel detector enables multi-angle observation without losing magnification, while the 5-axis linkage system supports fast, accurate positioning.
Designed for mass production, it features automated inspection programming, one-click navigation, and simple operation (2-hour training). The maintenance-free X-ray tube and strict safety design meet industrial standards, making it ideal for SOP quality control in consumer electronics and automotive applications.