|
| Brand Name: | WELLMAN |
| Model Number: | X6000 |
| MOQ: | 1 |
| Payment Terms: | T/T |
| Type | Closed, microfocus |
| Max tube voltage | 90kV |
| Max tube current | 200μA |
| Focal spot size | 5μm |
| Function | Auto preheat |
| Effective area | 130mm*130mm |
| Pixel size | 85μm |
| Resolution | 1536*1536 |
| Frame rate | 20fps |
| Size | 420mm*420mm |
| Detectable area | 400mm*400mm |
| Max load | 15kg |
| Magnification | Geometry 150X | System 1500X |
| Inspection speed | Max 3.0s/point |
| Dimensions | 1100mm (L) * 1000mm (W) * 1600mm (H) |
| Weight | 1000kg |
| Power supply | AC110-220V 50/60HZ |
| Max power | 1300W |
| Industrial PC | Intel I5 CPU, 8G RAM, 240GB SSD |
| Displayer | 24" HDMI LCD |
| Radiation leakage | No leakage (≤1μSv/h, international standard) |
| Lead glass observation window | Transparent lead glass shields radiation while allowing internal observation |
| Window/door safety interlock | X-ray automatically powers off when window/door is opened |
| Electromagnetic safety switch | Locks observation window when X-ray is active |
| Emergency stop | Instant power-off button near operation position |
| Tube protection | Software prevents X-ray tube from being left on |
Full keyboard and mouse control for all functions including X-ray tube activation and parameter adjustment.
Adjustable brightness, contrast and gain for optimal image quality. Save and recall inspection parameters for repeat inspections.
Automatically calculates solder ball voids rate, area, circumference and identifies defects. Supports manual void marking and parameter saving for consistent results.
Comprehensive measurement capabilities including distance, angle, radius, perimeter, and distance rate calculations for through-hole soldering analysis.
Three modes: manual point setting, array pattern for regular points, and automatic feature recognition for efficient batch processing.
