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| Nombre De La Marca: | WELLMAN |
| Número De Modelo: | X6000 |
| Moq: | 1 |
| Precio: | 24000-34000 USD |
| Términos De Pago: | T/T |
Microfocus X-Ray Inspection System X6000
Maintenance-free X-ray tube system supports efficient inspection of BGA solder voids and PCB through-holes, combined with high-precision imaging.
| Type | Closed, microfocus |
|---|---|
| Max tube voltage | 90kV |
| Max tube current | 200μA |
| Focal spot size | 5μm |
| Function | Auto preheat |
| Effective area | 130mm×130mm |
|---|---|
| Pixel size | 85μm |
| Resolution | 1536×1536 |
| Frame rate | 20fps |
| Size | 420mm×420mm |
|---|---|
| Detectable area | 400mm×400mm |
| Max load | 15kg |
| Magnification | Geometry 150X | System 1500X |
|---|---|
| Inspection speed | Max 3.0s/point |
| Dimensions | 1100mm (L) × 1000mm (W) × 1600mm (H) |
| Weight | 1000kg |
| Power supply | AC110-220V 50/60HZ |
| Max power | 1300W |
| Industrial PC | Intel I5 CPU, 8G RAM, 240GB SSD |
| Displayer | 24" HDMI LCD |
| Radiation leakage | No leakage (≤1μSv/h, international standard) |
|---|---|
| Lead glass observation window | Transparent lead glass shields radiation while allowing internal observation |
| Window/door safety interlock | X-ray automatically powers off when window/door is opened |
| Electromagnetic safety switch | Locks observation window when X-ray is active |
| Emergency stop | Instant power-off button near operation position |
| Tube protection | Software prevents X-ray tube from being left on |
Full keyboard and mouse control for all functions, including X-ray tube activation and parameter adjustment.
Comprehensive measurement functions--including distance, angle, radius, perimeter, and distance rate calculations--are designed for through-hole soldering analysis.
Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.
Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.
Automatically calculates solder ball void rate, area, and circumference while identifying defects, and supports manual void marking and parameter saving for consistent results.
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