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X6000 Industrial X-Ray Inspection Equipment for PCB PCBA BGA IC LED Solder Joint Void and Defect Detection

X6000 Industrial X-Ray Inspection Equipment for PCB PCBA BGA IC LED Solder Joint Void and Defect Detection

Marchio: WELLMAN
Numero modello: X6000
Moq: 1
Termini di pagamento: T/T
Capacità di fornitura: Fornitura in tutto il mondo
Informazioni Dettagliate
Luogo di origine:
Cina
Certificazione:
CE,ISO9001,FDA
Voltaggio massimo del tubo:
90kV
Corrente massima del tubo:
200μA
Imballaggi particolari:
Custodia in legno
Capacità di alimentazione:
Fornitura in tutto il mondo
Evidenziare:

PCB X-Ray Inspection Equipment

,

BGA Solder Joint Void Detection

,

PCBA Defect Inspection Machine

Descrizione del prodotto
X6000 Industrial X-Ray Inspection Equipment Overview The X6000 is an advanced industrial X-ray inspection system engineered for BGA, LED, IC solder void analysis, crack detection, and PCBA quality control in SMT production lines. It combines a maintenance-free microfocus X-ray source, a high-definition flat panel detector, and programmable automated inspection software to deliver fast, repeatable defect detection for electronics manufacturing. Key Advantages of the X6000 X