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X6000 Industrial X-Ray Inspection Equipment for PCB PCBA BGA IC LED Solder Joint Void and Defect Detection

X6000 Industrial X-Ray Inspection Equipment for PCB PCBA BGA IC LED Solder Joint Void and Defect Detection

Markenname: WELLMAN
Modellnummer: X6000
MOQ: 1
Zahlungsbedingungen: T/T
Versorgungsfähigkeit: Weltweite Lieferung
Detailinformationen
Herkunftsort:
China
Zertifizierung:
CE,ISO9001,FDA
Maximale Röhrenspannung:
90kV
Maximaler Röhrenstrom:
200μA
Verpackung Informationen:
Holzkiste
Versorgungsmaterial-Fähigkeit:
Weltweite Lieferung
Hervorheben:

PCB X-Ray Inspection Equipment

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BGA Solder Joint Void Detection

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PCBA Defect Inspection Machine

Produktbeschreibung
X6000 Industrial X-Ray Inspection Equipment Overview The X6000 is an advanced industrial X-ray inspection system engineered for BGA, LED, IC solder void analysis, crack detection, and PCBA quality control in SMT production lines. It combines a maintenance-free microfocus X-ray source, a high-definition flat panel detector, and programmable automated inspection software to deliver fast, repeatable defect detection for electronics manufacturing. Key Advantages of the X6000 X