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X6000 Industrial X-Ray Inspection Equipment for PCB PCBA BGA IC LED Solder Joint Void and Defect Detection

X6000 Industrial X-Ray Inspection Equipment for PCB PCBA BGA IC LED Solder Joint Void and Defect Detection

Brand Name: WELLMAN
Model Number: X6000
MOQ: 1
Payment Terms: T/T
Supply Ability: Worldwide supply
Detail Information
Place of Origin:
China
Certification:
CE,ISO9001,FDA
Max Tube Voltage:
90kV
Max Tube Current:
200μA
Packaging Details:
Wooden case
Supply Ability:
Worldwide supply
Highlight:

PCB X-Ray Inspection Equipment

,

BGA Solder Joint Void Detection

,

PCBA Defect Inspection Machine

Product Description
X6000 Industrial X-Ray Inspection Equipment Overview

The X6000 is an advanced industrial X-ray inspection system engineered for BGA, LED, IC solder void analysis, crack detection, and PCBA quality control in SMT production lines. It combines a maintenance-free microfocus X-ray source, a high-definition flat panel detector, and programmable automated inspection software to deliver fast, repeatable defect detection for electronics manufacturing.

Key Advantages of the X6000 X-Ray Inspection System
  • Maintenance-Free Microfocus X-Ray Tube — Closed-type X-ray source rated for over 10,000 hours of service life.
  • 5-Inch HD Digital Flat Panel Detector (FPD) — New-generation detector delivering high-definition X-ray imaging.
  • Automatic Navigation System — Click any inspection position and the inspection table moves there automatically.
  • Large Inspection Stage — 420 × 420 mm platform with a maximum load capacity of 15 kg.
  • Speed-Adjustable 3-Axis Motion System — Three-axis linked movement with adjustable speed for precise X-ray inspection.
  • Programmable Automated X-Ray Inspection — Editable inspection programs support high-volume batch inspection.
  • Optional 360° Rotary Fixture — Enables multi-angle X-ray inspection of electronic components.
  • Easy-to-Operate PCB X-Ray Inspection — Fast defect detection with only about 2 hours of operator training required.
Working Principle
Diagram illustrating the working principle of 5-axis semiconductor inspection equipment showing X-ray source, detector, and sample positioning
Working principle of the X-ray inspection system: X-ray source, flat panel detector, and sample positioning.
Hardware Parameters
X-ray Source
TypeSealed, microfocus
Max Tube Voltage90kV
Max Tube Current200μA
Focal Spot Size5μm
FunctionAuto preheat
Flat Panel Detector
Effective Area130mm × 130mm
Pixel Size85μm
Resolution1536 × 1536
Frame Rate20fps
Inspection Table
Size420mm × 420mm
Detectable Area400mm × 400mm
Max Load15kg
Equipment Specifications
MagnificationGeometry 200X | System 1500X
Inspection SpeedMax 3.0s/point
Dimensions1360mm (L) × 1365mm (W) × 1730mm (H)
Weight1200kg
Power SupplyAC110–220V 50/60Hz
Max Power1500W
Industrial PCI5 CPU, 8G RAM, 500GB SSD
Displayer24" HDMI LCD
Industrial X-ray inspection machine overview showing the X6000 enclosure and inspection stage
X6000 industrial X-ray inspection machine overview.
X-ray inspection machine control interface showing software modules and real-time imaging
X-ray inspection machine control interface.
X-ray inspection machine side view showing the lead glass observation window and safety interlocks
X-ray inspection machine side view.
Safety Features
Radiation LeakageNo leakage
Lead Glass Observation WindowTransparent lead glass window shields radiation while allowing observation of the inner status
Window and Back Door Safety InterlockAutomatic X-ray power off when opened
Electromagnetic Safety SwitchLocks the observation window when X-ray is active
Emergency StopLocated near the operation position for immediate power cutoff
Tube ProtectionPrevents software exit without proper X-ray tube shutdown
Software Functions
Function ModuleAll operations can be completed with keyboard and mouse
X-ray Tube ControlClick the X button with the mouse to turn the X-ray on or off. Real-time tube voltage and current values are displayed alongside; users can click the up/down buttons, drag the slider, or type a value to adjust.
Status BarIndicates interlock status, pre-heat status, and X-ray status by flashing alternately red and green.
Image Effect AdjustmentBrightness, contrast, and gain of the image can be adjusted freely to achieve a satisfactory result.
Product ListUsers can save inspection parameters such as Z-axis position, brightness, contrast, and gain, and directly recall them when inspecting the same product to improve inspection efficiency.
Navigation WindowAfter the camera photographs the table, click anywhere in the photo and the table moves to the selected location and displays it on screen.
Motion Axis StatusDisplays real-time coordinates.
Inspection ResultMeasurement results (voids rate, distance, area, etc., as set by users) are displayed in order.
Speed ControlThe movement speed of each axis can be adjusted to slow, normal, or fast.
Voids Rate Measurement
Automatic CalculationClick two points to define a rectangle. The software automatically finds and measures the edge of the solder ball, the pad, and internal voids within the rectangle, returning data on voids rate, solder ball area, circumference, largest void rate, length, and width, and indicating NG or OK by red and green.
Parameters AdjustmentUsers can adjust the grayscale threshold, pixel, contrast, size filtering, and other parameters to obtain accurate automatic calculation results.
Add Voids ManuallyUsers can draw a polygon or free figure and calculate it as a void into the void rate.
Save ParametersUsers can save parameters such as grayscale threshold, pixel, contrast, and size filtering, and directly recall them when detecting the same product to improve detection efficiency.
Automatic Inspection
Manual SettingUsers can set any positions on the table as inspection points; the software automatically inspects and saves the picture.
ArrayFor regular inspection points, users only need to set two inspection points plus the number of rows and columns; the software automatically inspects each point and saves pictures.
Automatic IdentificationFor inspection points with obvious features, the software automatically identifies positions, takes measurements, and saves the image.
Other Measurement Functions
DistanceClick points A and B to set the baseline, then click point C to measure the vertical distance from C to the baseline.
Distance RateMostly used to measure the soldering rate of through-holes. Set an additional point D beyond the distance measurement; divide the vertical distance from D to the baseline by the vertical distance of C to obtain the percentage ratio of D to C.
AngleClick points A and B to set the baseline, then click point C to measure the angle between rays BA and BC.
RadiusMostly used to measure round components such as solder balls. Click three points to determine a circle and measure the circumference, area, and radius.
PerimeterMostly used to measure square components. Click two points to determine a square and measure the length, width, and area.
Application Examples