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| Brand Name: | WELLMAN |
| MOQ: | 1 |
| Payment Terms: | T/T |
The WELLMAN Flash 3D is a high-speed industrial X-ray computed tomography (CT) inspection system engineered for electronic manufacturing, PCB/PCBA inspection, and semiconductor packaging quality control.
By combining a high-precision 9-axis motion system, automatic 3D imaging, and AI-assisted defect recognition, the Flash 3D enables manufacturers to examine complex internal structures and identify hidden defects that are difficult to distinguish using conventional 2D X-ray inspection.
The system integrates automatic scanning, 3D reconstruction, image analysis, and defect classification into a streamlined inline inspection process, supporting efficient and consistent quality control.
| Parameter | Specification |
|---|---|
| X-Ray Tube Type | Closed-type X-ray source |
| Tube Voltage | 40–130 kV |
| Tube Current | 0.01–0.3 mA |
| Maximum Operating Power | 30–39 W |
| Control Mode | Constant-current control |
| Parameter | Specification |
|---|---|
| Detector Type | CMOS Detector |
| Pixel Size | 50 μm |
| Pixel Matrix | 2802 × 2400 |
| Effective Imaging Area | 140.1 × 120.0 mm |
| Frame Rate | 29 fps (1 × 1) |
| Parameter | Specification |
|---|---|
| Motion System | 9-Axis High-Precision System |
| JIMA Test Chart Resolution | 4 μm |
| Geometric Magnification | Up to 19.2× |
| Equipment Dimensions | 2670 × 2200 × 2160 mm |
| Height Including Signal Light | 2400 mm |
| Equipment Weight | 5.6 Tons |
| Power Supply | AC 220V ±10%, 50–60 Hz, Single Phase |
| Maximum Power Consumption | 6.5 kW |
| Radiation Leakage Rate | Less than 1 μSv/h at 10 cm from enclosure surface |
| Parameter | Specification |
|---|---|
| Maximum Sample Size | 800 × 700 mm |
| Minimum Sample Size | 80 × 80 mm |
| Maximum Imaging Area | 750 × 680 mm |
| Maximum Sample Weight | 10 kg |
The Flash 3D uses industrial X-ray computed tomography technology to obtain three-dimensional information about the internal structure of electronic components and assemblies.
During inspection, the system acquires X-ray projection data through its high-precision scanning mechanism. The integrated reconstruction software processes the acquired data to generate 3D images and cross-sectional views.
Unlike conventional 2D X-ray imaging, where overlapping structures can make defects difficult to identify, 3D CT provides multiple sectional views for detailed analysis of internal components, solder connections, and PCB structures.
The system combines CT reconstruction with AI-assisted image recognition to support automatic defect identification, classification, and quantitative analysis.
The system integrates AI-based algorithms to identify and analyze various defects in PCB, PCBA, and semiconductor components.
The Flash 3D supports user-defined inspection workflows, allowing operators to create and save scanning programs according to component types, product dimensions, and inspection requirements.
Operators can configure parameters including X-ray voltage, tube current, imaging resolution, and sampling settings.
Saved inspection templates can be reused for repeated production inspections, helping maintain consistency and improve inspection efficiency.
Built-in image processing algorithms help improve the visibility of internal structures and soldering defects.
The software supports image enhancement, 3D reconstruction, sectional viewing, defect measurement, and inspection result management.
The Flash 3D supports the inspection of large PCB and PCBA assemblies, including multilayer board structures and hidden solder connections.
Typical applications include PCB back-drill stub measurement, internal void detection, solder joint quality analysis, and internal structural inspection.
The system is suitable for detecting hidden soldering defects in surface-mounted electronic components.
Typical applications include:
The Flash 3D provides three-dimensional visualization for semiconductor packages, ICs, IGBTs, sensors, and MEMS components.
Inspection applications include internal structural defects, wire bonding abnormalities, voids, delamination, and electrical interconnection defects.
The system supports inspection of through-hole solder joints and press-fit connectors, including solder filling, pin insertion, and connection quality.
The Flash 3D combines high-speed scanning, industrial CT imaging, automated inspection programming, and intelligent defect analysis in one integrated system.
For electronic manufacturers handling complex PCB assemblies and high-density semiconductor packages, it provides a solution for examining hidden internal structures, measuring critical defects, and improving production quality control.
Address
5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen
Tel
+86-1840-6666--351
