The X8800 Rapid Multi-layer Semiconductor Inspection Equipment offers advanced 3D/CT capabilities for comprehensive semiconductor analysis and quality control.

Key Advantages

Open type X-ray tube: No service life limit, only filament replacement required
New generation 5" HD digital flat panel detector (FPD)
FPD can tilt 60° and rotate 360° for flexible positioning
Automatic navigation window - table moves to clicked positions
400×400mm table with 10KG load capacity
Speed adjustable 5-axis linkage system
Supports optional ACT and PCT 3D CT functions
Easy to operate with quick defect detection - only 2 hours training required

Hardware Specifications

X-ray Source
Type	Open, microfocus
Max Tube Voltage	160kV
Max Tube Current	500μA
Target Power	15W
Tube Power	65W
Focal Spot Size	1μm

Flat Panel Detector
Effective Area	130mm×130mm
Pixel Size	49.5μm
Resolution	1536×1536
Frame Rate	20fps
Tiltable Angle	60°
Rotation Angle	360°

Table Specifications
Size	400mm×400mm
Detectable Area	400mm×400mm
Max Load	10kg

Equipment Specifications
Geometry Magnification	2500X
Inspection Speed	Max 3.0s/point
Dimensions	1550mm (L) × 1600mm (W) × 1700mm (H)
Weight	1800kg
Power Supply	AC110-220V 50/60HZ
Max Power	1800W
Industrial PC	I7 CPU, 16G RAM, 240GB SSD+1TB HDD
Displayer	24" HDMI LCD

Safety Features
Radiation Leakage	No leakage, international standard: ≤1μSv/h
Lead Glass Observation Window	Transparent lead glass window shields radiation to observe inner status
Window and Back Door Safety Interlock	X-ray tube powers off immediately when window or back door is opened
Electromagnetic Safety Switch	Locks when X-ray is on, preventing window opening
Emergency Stop	Located next to operation position for immediate power off
Tube Protection	Software prevents leaving without closing X-ray tube

Software Functions

Function Module	Operation
X-ray Tube Control	Mouse-click X button to turn on/off X-ray. Real-time voltage and current display with adjustable settings
Status Bar	Indicates interlock status, pre-heat status, and X-ray status with red/green flashing
Image Effect Adjustment	Adjustable brightness, contrast and gain for optimal image quality
Product List	Save inspection parameters for efficient repeated product inspection
Navigation Window	Click anywhere in table photo to move table to selected position
Motion Axis Status	Real-time coordinate display
Inspection Result	Measurement results display in order (voids rate, distance, area, etc.)
Speed Control	Adjustable movement speed for each axis (slow, normal, fast)

Voids Rate Measurement

Automatic Calculation: Click two points to define rectangle - software automatically measures solder ball edges, pads, and internal voids
Parameters Adjustment: Adjust grayscale threshold, pixel, contrast, size filtering for accurate results
Add Voids Manually: Draw polygons or free figures to calculate as voids
Save Parameters: Store measurement parameters for efficient repeated product inspection

Other Measurement Functions

Distance: Measure vertical distance from point to baseline
Distance Rate: Measure soldering rate of through-holes using percentage ratio
Angle: Measure angle between rays
Radius: Measure round components (solder balls) - circumference, area, radius
Perimeter: Measure square components - length, width, area

Automatic Inspection

Manual Setting: Set any table positions as inspection points with automatic inspection and image saving
Array: Automatic inspection of regular points using row/column configuration
Automatic Identification: Software automatically identifies positions with obvious features for measurement

Working Principle

Working Principle Diagram

Application Examples

BGA Solder Bridge

BGA Solder Voids

PCB Through-Hole

IC Voids and Gold Wire

LED Solder Voids

LED Gold Wire Crack

Capacitor

Inductor

Sensor