Application Details

Home > Application >

company Application about WELLMAN X6800 X-Ray Detects IGBT Module Welding Defects

Mr. Jeff Chan

sales8@well-man.com

+86-1840-6666--351

＋86 18406666351

Contact Now

WELLMAN X6800 X-Ray Detects IGBT Module Welding Defects

Industry Pain Point

IGBT power modules are core components for new energy vehicles, photovoltaic inverters and industrial power supplies. Internal solder voids, poor bonding and chip hidden cracks will raise thermal resistance, cause overheating and shorten service life. Traditional visual inspection cannot penetrate multi-layer metal-ceramic structures, leading to missed defects.

Solution: WELLMAN X6800 Microfocus X-Ray Inspection Machine

Our X6800 is perfectly matched for IGBT non-destructive quality inspection, with core advantages targeting power semiconductor production:

1. 60° tiltable HD flat panel detector

The detector tilts instead of the stage, without losing magnification. Multi-angle imaging clearly distinguishes chip solder layer and DBC substrate solder layer, avoiding overlapping structure occlusion.

2. 5-axis linkage + large 530×530mm stage

10KG load capacity fits various sizes of IGBT modules; automatic navigation locates detection areas with one click.

3. Intelligent void rate automatic measurement software

One-click analysis of solder void area, maximum void ratio, automatically mark OK/NG, support saving inspection parameters for mass batch testing.

4. Long-life microfocus Hamamatsu X-ray tube

Stable penetration for thick copper baseplates, clear imaging of tiny voids and gold wire cracks inside IGBT.

Inspection Items for IGBT Modules

Chip solder layer void ratio exceeding standard

DBC substrate welding bubbles & delamination

Bonding wire breakage, offset and poor bonding

Chip internal cracks, abnormal solder bridging

On-site Application Effect

A power semiconductor factory adopts X6800 for full inspection of finished IGBT modules:

Automatic inspection program editing, realize unmanned batch detection;

Uniform void rate measurement standard, eliminate human judgment error;

2-hour quick training for operators, easy to get started;

Complete radiation safety interlock design, meet factory safety production standards.

Summary

WELLMAN X6800 provides reliable non-destructive inspection for IGBT packaging process, effectively controlling welding quality and improving the long-term reliability of power modules.

＋86 18406666351

Quick link

Home About Us Products Application video News Cases Contact Us

Quick Contact

Address

5F,B3, Anda ElectronicsIndustrial Factory, HepingCommunity, Fuhai Street, BaoanDistrict, Shenzhen

Tel

+86-1840-6666--351

E-mail

sales8@well-man.com

＋86 18406666351

Our Newsletter

Subscribe to our newsletter for discounts and more.

X Ray Counter

PCB X Ray Machine

SMD Tower

Automated X Ray Inspection

Electronics X Ray Machine

Solder Paste Storage Cabinet

Hamamatsu X Ray Source

BGA X Ray Machine

Automatic Splicing Machine

SMT X Ray Machine

Hamamatsu Image Intensifier

3D X Ray Inspection

X Ray Image Intensifier

X Ray Counter

PCB X Ray Machine

SMD Tower

Automated X Ray Inspection

Electronics X Ray Machine

Solder Paste Storage Cabinet

Hamamatsu X Ray Source

BGA X Ray Machine

Automatic Splicing Machine

SMT X Ray Machine

Hamamatsu Image Intensifier

3D X Ray Inspection

X Ray Image Intensifier

company Application about WELLMAN X6800 X-Ray Detects IGBT Module Welding Defects

WELLMAN X6800 X-Ray Detects IGBT Module Welding Defects

Industry Pain Point

Solution: WELLMAN X6800 Microfocus X-Ray Inspection Machine

Inspection Items for IGBT Modules

Chip solder layer void ratio exceeding standard

DBC substrate welding bubbles & delamination

Bonding wire breakage, offset and poor bonding

Chip internal cracks, abnormal solder bridging

On-site Application Effect

Summary