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3D X Ray Inspection Equipment For Solder Joint Defects 750mm×530mm

3D X Ray Inspection Equipment For Solder Joint Defects 750mm×530mm

Brand Name: WELLMAN
Model Number: Ultra-Inline CT/3D
MOQ: 1
Payment Terms: T/T
Detail Information
Place of Origin:
CHINA
Certification:
CE FDA
X-ray Tube Type:
Closed-tube X-ray Source
Tube Voltage Range:
45-130 KV
Tube Current Range:
0-0.5 MA
Maximum Operating Power:
65W
Pixel Size:
49.8 μm
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3D Xray inspection equipment

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750mmx530mm X ray inspection system

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solder joint defect Inspection equipment

Product Description
Ultra-Inline Equipment for Fast and Accurate Solder Joint Defect Analysis 3D X Ray Inspection
3D X Ray Inspection for Solder Joint Defects - Fast and Accurate Analysis with Ultra-Inline CT/3D Equipment
Detector Parameters
Parameter Specification
Detector type Amorphous silicon flat panel detector
Pixel size 49.8 μm
Pixel matrix 2304×2813
Effective imaging area 115 mm×140 mm
Picture frame rate 18 fps (1×1)
Equipment Performance Parameters
Parameter Specification
Maximum possible sample size 750 mm×530 mm (Length x Width)
Maximum imaging area 730 mm×510 mm (Length x Width)
JIMA card resolution 4μm
Equipment weight 5T
Equipment size 2336 mm×2321 mm×2109 mm (Length × width × height)
Imaging software system A set of online plate CT imaging system, including integrated scanning, data analysis and other modules
X-ray Source Parameters
Parameter Specification
X-ray Tube Type Closed-tube X-ray source
Tube voltage range 45-130 KV
Tube current range 0-0.5 mA
Maximum operating power 65W
Ultra-Inline CT/3D Equipment Features
  • Full 3D automatic imaging and analysis
  • Applicable for both on-line inspection and off-line analysis
  • Capable of achieving fast CT imaging, with the fastest local imaging time less than 3 seconds
  • Solves the problem of solder joint defect inspection that cannot be achieved by traditional 2D and 2.5D equipment
  • Can be connected to the user's database to directly import inspection results
Inspection Applications
  • Large-sized PCBA boards
  • The internal structure quality of semiconductor packaging products
  • The welding quality of various types of SMT solder joints, including open soldering, wetting conditions, solder volume, offset, foreign objects, bridging, and the presence of pins