Brief: In this video, we explore how the X6800 PCB X-ray Inspection Machine's 5-axis system and advanced imaging capabilities deliver precise internal analysis of electronic components. You'll see a demonstration of automated batch inspection, real-time defect identification, and measurement functions for BGA solder voids, IC gold wires, and PCB through-holes, showcasing how its design ensures reliable, high-magnification inspection for industrial applications.
Related Product Features:
Closed-type microfocus X-ray tube with over 10,000 hours lifetime and maintenance-free operation.
5-axis linkage system with adjustable speed for precise positioning and inspection.
5-inch high-definition digital flat panel detector (FPD) with 60° tilt capability.
Automatic navigation window moves the table to clicked locations for efficient inspection.
Programmable inspection procedures enable automated batch inspection for consistent results.
Real-time measurement functions for voids rate, distance, angle, and component dimensions.
Comprehensive safety features including radiation leakage control and emergency stop button.
Intuitive software with quick defect identification, requiring only 2 hours of training.
FAQs:
What is the magnification capability of the X6800 PCB X-ray Inspection Machine?
The X6800 offers a geometric magnification of 200X and a system magnification of up to 1500X, providing detailed internal views of PCBs and components.
How does the machine ensure operator safety during X-ray inspection?
Safety is ensured through radiation leakage control (≤1μSv/h), transparent lead glass observation windows, safety interlock systems, electromagnetic safety switches, and an emergency stop button.
Can the X6800 perform automated inspections for batch processing?
Yes, it supports programmable inspection procedures and automatic feature recognition, allowing for efficient automated batch inspection of multiple components.
What types of defects can the X6800 detect in electronic components?
It can identify various defects including BGA solder bridges and voids, PCB through-hole issues, IC voids and gold wire cracks, LED solder voids, and capacitor or inductor faults.