BGA Inspection Solution for Canadian Automotive Suppliers

I. Customer Background
A Canadian electronic manufacturing company (established in 2015, mainly engaged in BGA chip packaging for automotive electronics), supplies vehicle control modules to North American automakers. It produces 5,000+ BGA components per month and needs to ensure that there are no defects such as voids or incomplete soldering points in the BGA solder joints. 
II. Core Pain Points
Insufficient detection accuracy: The original equipment could not identify voids inside BGA solder joints (the detection rate was only 70%), resulting in increased rework costs.
Low efficiency and difficulty in meeting deadlines: Manual auxiliary detection took 12 minutes per piece, resulting in a monthly production gap of 1,000 pieces. It was fined twice due to delivery delays; 
Difficulty in data traceability: The detection records were stored on paper, making it impossible to quickly retrieve data during customer audits, affecting the trust in the cooperation. 
III. Customized Solution
Provide BGA detection equipment: 
Equipped with high-definition industrial cameras + AI algorithms, accompanied by a cloud system, the detection data is uploaded in real time, and it supports one-click report export. 
IV. Implementation and Results
Implementation: 10 days of research and customization → 20 days of production testing → 2 days of on-site installation and training, and the entire process was completed within one month; 
Results: 
The defective rate decreased from 5% to 0.3%; 
The monthly production capacity increased to 6,200 pieces, the delivery schedule achievement rate reached 100%, and there was no loss of penalty fees; 
The customer audit pass rate was 100%, and one new carmaker order was added, with an estimated annual revenue increase of 200,000 Canadian dollars. 
Production Manager Lisa: "The 3D detection equipment has solved our quality issues and has increased efficiency by several times. Now we have more confidence in taking orders!"