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Non-destructive X-ray testing equipment for bga pcb and semiconductor component analysis

Non-destructive X-ray testing equipment for bga pcb and semiconductor component analysis

Brand Name: WELLMAN
Model Number: X-6000
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certification:
CE,FDA,ISO9001
Max Tube Voltage:
90kV
Focal Spot Size:
5μm
Table Size:
420mm×420mm
Max Power:
1300W
Packaging Details:
wooden case
Product Description
Non-destructive X-ray Testing Equipment for BGA PCB and Semiconductor Component Analysis
Working Principle
Non-destructive X-ray testing equipment for bga pcb and semiconductor component analysis 0
Key Advantages
X-ray Tube
  • 10000 Hours Lifetime
  • Zero Leakage Radiation
  • Maintenance-free
Flat Panel Detector
  • 13×13 cm high-definition large-area
  • Tiltable 30°/60°/180° (optional)
Table Stage

420×420mm table with 15KG load capacity

Easy Operation

Only 2 hours to train (No training fee)

Navigation Window

The table will move to where you click and display on the screen

Motion Axis
  • 3-axes coordination
  • Speed (slow, normal, fast)
Hardware Specifications
X-ray Source
Type Closed, microfocus
Max Tube Voltage 90kV (optional)
Max Tube Current 200μA
Focal Spot Size 5μm
Function Auto preheat
Flat Panel Detector
Effective Area 130mm×130mm
Pixel Size 85μm
Resolution 1536×1536
Frame Rate 20fps
Table
Size 420mm×420mm
Detectable Area 400mm×400mm
Max Load 15kg
Equipment
Magnification Geometry 150X | System 1500X
Inspection Speed Max 3.0s/point
Dimensions 1100mm (L) × 1000mm (W) × 1600mm (H)
Weight 1000kg
Power Supply AC110-220V 50/60HZ
Max Power 1300W
Industrial PC Intel I5 CPU, 8G RAM, 240GB SSD
Displayer 24" HDMI LCD
Safety Features
Feature Description
Radiation leakage No leakage, international standard: ≤1μSv/h
Lead glass observation window Transparent lead glass window shields radiation to observe the inner status
Window and back door safety interlock Once users open the window or back door, X-ray tube will power off immediately. When the window or back door is open, users can't turn on the X-ray
Electromagnetic safety switch Lock once the X-ray is on, users can't open the observation window
Emergency stop Next to the operation position, press to power off
Tube protection User can't leave the software if you don't close the X-ray tube
Software Functions

Keyboard and mouse can finish all operations

Function Module Description
X-ray tube control Using mouse to click the X button can turn on or off the X-ray. The real-time tube voltage and current value will display beside, users can click up and down button, or drag the slider, or type to adjust
Status bar Indicates the interlock status, pre-heat status, and X-ray status by flashing alternately red and green
Image effect adjustment The brightness, contrast and gain of the image can be adjusted freely to achieve a satisfactory result
Product list Users can save the inspection parameters such as Z-axis position, brightness, contrast and gain, and can directly call the parameters when inspecting the same product, to improve the inspection efficiency
Navigation window After the camera takes a photo of the table, click anywhere in the photo, the table will move to the place you click and display on the screen
Motion axis status Display real-time coordinates
Inspection result The measurement results (voids rate, distance, area, etc., set by users) display in order
Speed control The movement speed of each axis can be adjusted to slow, normal and fast
Voids Rate Measurement
Function Description
Automatic calculation Click on two points to determine a rectangle. The software automatically finds and measures the edge of the solder ball in the rectangle, the pad and the internal voids, and can get the data of the voids rate, the area of the solder ball, the circumference, the biggest void's rate, the length and the width, and indicates NG or OK by red and green
Parameters adjustment Users can adjust the grayscale threshold, pixel, contrast, size filtering and other parameters to get accurate results of automatic calculation
Add voids manually Users can draw a polygon or a free figure and calculate it as a void into the void rate
Save parameters Users can save parameters such as grayscale threshold, pixel, contrast, size filtering and other parameters, and can directly call the parameters when detecting the same product, to improve the detection efficiency
Other Measurement Functions
Function Description
Distance Click the A and B points to set as the baseline, then click the C point to measure the vertical distance from the C point to the baseline
Distance Rate Mostly used to measure the soldering rate of the through-hole. Set one more point "D" than the distance. Divide the vertical distance from the D point to baseline by the vertical distance of the C point, to obtain the percentage ratio of the vertical distance of D to C
Angle Click the A and B points to set as the baseline, then click the C point to measure the angle between the BA and BC rays
Radius Mostly used to measure round components such as solder balls. Click three points to determine a circle and measure the circumference, area and radius
Perimeter Mostly used to measure square components, click two points to determine a square, measure the length, width and area
Automatic Inspection
Mode Description
Manual Setting Users can set any positions on the table as inspection points, the software will automatically inspect and save the picture
Array For the regular inspection points, users only need to set two of the inspection points and the number of rows and columns, the software will automatically inspect each point and save pictures
Automatic Identification For inspection points with obvious features, the software automatically identifies the positions, takes measurements, and saves the image
Application Examples
Non-destructive X-ray testing equipment for bga pcb and semiconductor component analysis 1
BGA Solder Bridge
Non-destructive X-ray testing equipment for bga pcb and semiconductor component analysis 2
BGA Solder Voids
Non-destructive X-ray testing equipment for bga pcb and semiconductor component analysis 3
PCB Through-Hole
Non-destructive X-ray testing equipment for bga pcb and semiconductor component analysis 4
IC Voids and Gold Wire
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LED Solder Voids
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LED Gold Wire Crack
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Capacitor
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Inductor
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Sensor
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Thyristor Surge Suppressors
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Fiberglass
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Cable
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Diode
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Steel Pipe Welding Gap
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